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PESM : 3rd workshop on Plasma Etch and Strip in Microelectronics

Continuing downscaling of semiconductors devices brings new challenges for plasma etch and strip. New materials (high-k and low-k dielectrics, metal gates, phase-shift memories etc.) and new architectures (3D devices, channel-engineered devices etc.) require new etch and strip approaches. We organize this workshop to bring together people from research institutions and industry to discuss new challenges in plasma etch and strip.

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A la Maison Minatec - organisé apr IMEC et CEA-Leti